Printed n- and p-channel transistors using silicon nanoribbons enduring electrical, thermal, and mechanical stress

Neto, J., Dahiya, A. S. , Zumeit, A., Christou, A., Ma, S. and Dahiya, R. (2023) Printed n- and p-channel transistors using silicon nanoribbons enduring electrical, thermal, and mechanical stress. ACS Applied Materials and Interfaces, 15(7), pp. 9618-9628. (doi: 10.1021/acsami.2c20569) (PMID:36774654)

Abstract

Printing technologies are changing the face of electronics with features such as resource-efficiency, low-cost, and novel form factors. While significant advances have been made in terms of organic electronics, the high-performance and stable transistors by printing, and their large-scale integration leading to fast integrated circuits remains a major challenge. This is because of the difficulties to print high-mobility semiconducting materials and the lack of high-resolution printing techniques. Herein, we present silicon based printed n- and p-channel transistors to demonstrate the possibility of developing high-performance complementary metal–oxide–semiconductor (CMOS) computing architecture. The direct roll transfer printing is used here for deterministic assembly of high-mobility single crystal silicon nanoribbons arrays on a flexible polyimide substrate. This is followed by high-resolution electrohydrodynamic printing to define source/drain/gate electrodes and to encapsulate, thus leading to printed devices. The printed transistors show effective peak mobilities of 15 cm2/(V s) (n-channel) and 5 cm2/(V s) (p-channel) at low 1 V drain bias. Furthermore, the effect of electrical, mechanical, and thermal stress on the performance and stability of the encapsulated transistors is investigated. The transistors showed stable transfer characteristics even after: (i) continuous 4000 transfer cycles, (ii) excruciating 10000 bending cycles at different bending radii (40, 25, and 15 mm), and (iii) between 15 and 60 °C temperatures.

• Item Type: Articles
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Dahiya, Dr Abhishek Singh and Zumeit, Ayoub and Neto, Mr Joao and Dahiya, Professor Ravinder and Ma, Sihang and Christou, Mr Adamos
• Authors: Neto, J., Dahiya, A. S., Zumeit, A., Christou, A., Ma, S., and Dahiya, R.
• College/School: College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• Journal Name: ACS Applied Materials and Interfaces
• Publisher: American Chemical Society
• ISSN: 1944-8244
• ISSN (Online): 1944-8252
• Published Online: 12 February 2023
• Copyright Holders: Copyright © 2023 American Chemical Society
• First Published: First published in ACS Applied Materials and Interfaces 15(7): 9618-9628
• Publisher Policy: Reproduced under a Creative Commons License

Project Code	Award No	Project Name	Principal Investigator	Funder's Name	Funder Ref	Lead Dept
301728		Engineering Fellowships for Growth: Printed Tactile SKIN	Ravinder Dahiya	Engineering and Physical Sciences Research Council (EPSRC)	EP/R029644/1	ENG - Electronics & Nanoscale Engineering
301327		`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturing	Peter Skabara	Engineering and Physical Sciences Research Council (EPSRC)	EP/R03480X/1	ENG - Electronics & Nanoscale Engineering