Glover, J., Khalid, A. , Stephen, A., Dunn, G., Cumming, D. and Oxley, C. H. (2015) Micro-coolers fabricated as a component in an integrated circuit. Semiconductor Science and Technology, 30(1), 015005. (doi: 10.1088/0268-1242/30/1/015005)
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Publisher's URL: http://dx.doi.org/10.1088/0268-1242/30/1/015005
Abstract
The packing density and power capacity of integrated electronics is increasing resulting in higher thermal flux densities. Improved thermal management techniques are required and one approach is to include thermoelectric coolers as part of the integrated circuit. An analysis will be described showing that the supporting substrate will have a large influence on the cooling capacity of the thermoelectric cooler. In particular, for materials with a low ZT figure of merit (for example gallium arsenide (GaAs) based compounds) the substrate will have to be substantially thinned to obtain cooling, which may preclude the use of thermoelectric coolers, for example, as part of a GaAs based integrated circuit. Further, using experimental techniques to measure only the small positive cooling temperature difference (ΔT) between the anode (Th) and the cathode (Tc) contacts can be misinterpreted as cooling when in fact it is heating.
| Item Type: | Articles |
|---|---|
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Cumming, Professor David and Dunn, Dr Geoffrey and Khalid, Dr Ata-Ul-Habib |
| Authors: | Glover, J., Khalid, A., Stephen, A., Dunn, G., Cumming, D., and Oxley, C. H. |
| College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
| Journal Name: | Semiconductor Science and Technology |
| Publisher: | IOP Publishing |
| ISSN: | 0268-1242 |
| ISSN (Online): | 1361-6641 |
| Copyright Holders: | Copyright © 2015 IOP Publishing Ltd |
| First Published: | First published in Semiconductor Science and Technology 30(1):015005 |
| Publisher Policy: | Reproduced under a Creative Commons License |
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