Dahiya, R.S. (2013) Towards ultra-thin high-performance bendable electronic skin. In: 2013 IEEE International Conference on Robotics and Automation, Karlsruhe, Germany, 6-10 May 2013,
Full text not currently available from Enlighten.
Publisher's URL: http://www.icra2013.org/
Abstract
No abstract available.
| Item Type: | Conference Proceedings |
|---|---|
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Dahiya, Professor Ravinder |
| Authors: | Dahiya, R.S. |
| College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
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