Liquid cooling of non-uniform heat flux of chip circuit by submicrochannels

AlWaaly, A. A. Y., Paul, M. C. and Dobson, P. (2014) Liquid cooling of non-uniform heat flux of chip circuit by submicrochannels. In: International Conference on Advances in Civil, Structural and Mechanical Engineering - CSME 2014, London, UK, 1-2 Jun 2014, pp. 155-159. (doi: 10.15224/ 978-1-63248-012-5-116)

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Sumbmicrochannels have been placed on the hotspots in a non-uniform heat generated chip circuit to increase the liquid/solid interaction area and then to enhance the heat dissipation. Main microchannels width is 185µm, which is twice the width of the submicrochannels and also includes the wall thickness of 35µm, and wall height is 500µm. The chip dimension is 10mm×10mm and the hotspot is 4mm×10m. Different positions of the hotspot have been investigated e.g. upstream, middle and downstream. Uniform heat flux is 100W/cm2 while for the hot spot is 150 W/cm2. Single channel simulation reveals that the downstream hotspot gives a lower temperature of the chip circuit surface; however the upstream hotspot has more uniform temperature distribution. A special design of manifold was adopted to ensure an equal mass distribution through the microchannels.

Item Type:Conference Proceedings
Glasgow Author(s) Enlighten ID:Paul, Professor Manosh and Dobson, Dr Phil
Authors: AlWaaly, A. A. Y., Paul, M. C., and Dobson, P.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
College of Science and Engineering > School of Engineering > Systems Power and Energy
Copyright Holders:Copyright © 2014 Institute of Research Engineers and Doctors
Publisher Policy:Reproduced in accordance with the copyright policy of the publisher
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