Thermal conductivity measurement methods for SiGe thermoelectric materials

Ferre Llin, L. et al. (2013) Thermal conductivity measurement methods for SiGe thermoelectric materials. Journal of Electronic Materials, 42(7), pp. 2376-2380. (doi: 10.1007/s11664-013-2505-3)

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A new technique to measure the thermal conductivity of thermoelectric materials at the microscale has been developed. The structure allows the electrical conductivity, thermal conductivity, and Seebeck coefficient to be measured on a single device. The thermal conductivity is particularly difficult to measure since it requires precise estimation of the heat flux injected into the material. The new technique is based on a differential method where the parasitic contributions of the supporting beams of a Hall bar are removed. The thermal measurements with integrated platinum thermometers on the device are cross-checked using thermal atomic force microscopy and validated by finite-element analysis simulations.

Item Type:Articles
Glasgow Author(s) Enlighten ID:Weaver, Professor Jonathan and Ferre Llin, Dr Lourdes and Dobson, Dr Phil and Zhang, Dr Yuan and Samarelli, Mr Antonio and Paul, Professor Douglas
Authors: Ferre Llin, L., Samarelli, A., Zhang, Y., Weaver, J.M.R., Dobson, P., Cecchi, S., Chrastina, D., Isella, G., Etzelstorfer, T., Stangl, J., Muller Gubler, E., and Paul, D.J.
Subjects:Q Science > QC Physics
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Journal of Electronic Materials
ISSN (Online):1543-186X

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