Holik, S.M. and Drysdale, T.D. (2011) Simplified model of a layer of interconnects under a spiral inductor. Journal of Electromagnetic Analysis and Applications, 03(06), pp. 187-190. (doi: 10.4236/jemaa.2011.36031)
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Publisher's URL: http://dx.doi.org/10.4236/jemaa.2011.36031
Abstract
An empirical effective medium approximation that provides a homogeneous equivalent for a layer of interconnects un-derneath a spiral inductor is presented. When used as part of a numerical 3D model of the inductor, this approach yields a faster simulation that uses less memory, yet still predicts the quality factor and inductance to within 1%. We expect this technique to find use in the electromagnetic modeling of System-on-Chip.
| Item Type: | Articles |
|---|---|
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Drysdale, Dr Timothy |
| Authors: | Holik, S.M., and Drysdale, T.D. |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
| Journal Name: | Journal of Electromagnetic Analysis and Applications |
| ISSN: | 1942-0730 |
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