Enhancing Isolation in Solidly Mounted Resonators for Brain Implantable Microbots

Mazón Maldonado, L., Shojaei Baghini, M. , Parvizi, R. and Heidari, H. (2023) Enhancing Isolation in Solidly Mounted Resonators for Brain Implantable Microbots. In: IEEE 30th International Conference on Electronics, Circuits and Systems (ICECS), Istanbul, Turkey, 4-7 Dec 2023, ISBN 9798350326499 (doi: 10.1109/ICECS58634.2023.10382828)

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Abstract

Implantable brain devices have been used for deep brain neurostimulation over past decades. Wireless power and data transmission is still one of the main challenges in such devices. Among various technologies for providing high performance power/data rate, microfabricated magnetoelectric resonators such as Solidly Mounted Resonators (SMR), are often utilized in microwave applications due to their high tolerance and electromechanical coupling. In this study, we propose the optimization of a multilayer SMR to be implemented in brain microbots. The Multiphysics simulations are carried out via finite element modeling in COMSOL. ZnO was used as active layer of the SMR, and its thickness was tuned to obtain peak resonance at 2.5 GHz, with a layer of SiO 2 as encapsulant. The shift in the resonant frequency with varying number of stacks beneath the active area was analyzed, finding first sharp the fundamental mode of resonance around 1.3 GHz on average. Based on our simulation results, SMRs with a quality factor up to 963 were designed, with an improved S 11 of −,15.15 dB.

Item Type:Conference Proceedings
Additional Information:Funded by EU’s HORIZON-EIC-2021-PATHFINDERCHALLENGES - GA n. 101070908.
Keywords:SMR, resonator, piezoelectric, reflector, scattering parameter, Bragg reflector.
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Shojaei Baghini, Ms Mahdieh and Mazon Maldonado, Laura and Parvizi, Dr Roghaieh and Heidari, Professor Hadi
Authors: Mazón Maldonado, L., Shojaei Baghini, M., Parvizi, R., and Heidari, H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
ISBN:9798350326499
Published Online:10 January 2024
Copyright Holders:Copyright © 2023 IEEE
First Published:First published in IEEE 30th International Conference on Electronics, Circuits and Systems (ICECS)
Publisher Policy:Reproduced under a Creative Commons License
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