Liu, Y., Hafezi, M. and Feeney, A. (2023) Fabrication and Characterisation of a Nitinol Langevin Transducer. In: 2023 IEEE International Ultrasonics Symposium (IUS), Montreal, Canada, 3-8 September 2023, ISBN 9798350346459 (doi: 10.1109/IUS51837.2023.10308112)
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Abstract
A new generation of ultrasonic transducer is emerging which incorporates advanced materials such as shape memory alloys. Recently, the flextensional cymbal transducer was fabricated using the shape memory alloy Nitinol to introduce tuneable frequency dynamics for applications including adaptive sensing. The elastic properties of Nitinol are highly dependent on modest temperature shifts, hence frequency tuneability of thousands of Hz was possible. However, this has not yet been achieved for the Langevin ultrasonic transducer, one of the most common power ultrasonic classes. To investigate the opportunities for a tuneable frequency, or adaptive, Langevin transducer, this study aims to explore the fabrication challenges in transducer construction and demonstrate the dynamic characteristics of a prototype. End-masses of the Nitinol Langevin transducer were fabricated by the electrical discharge machining, after which characterisations were conducted through laser Doppler vibrometry at ambient room temperature and impedance analysis at elevated temperatures towards 50°C. Results demonstrate the tuneability of the resonance and antiresonance frequencies, in the order of 1 kHz, and their electrical impedances. This research demonstrates the potential for adaptive ultrasonic Langevin transducers for a wide range of medical and industrial applications.
Item Type: | Conference Proceedings |
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Status: | Published |
Refereed: | Yes |
Glasgow Author(s) Enlighten ID: | Liu, Mr Yuchen and Feeney, Dr Andrew and Hafezi, Dr Mahshid |
Authors: | Liu, Y., Hafezi, M., and Feeney, A. |
College/School: | College of Science and Engineering > School of Engineering > Systems Power and Energy |
ISSN: | 1948-5727 |
ISBN: | 9798350346459 |
Published Online: | 07 November 2023 |
Copyright Holders: | Copyright © 2023 IEEE |
First Published: | First published in 2023 IEEE International Ultrasonics Symposium (IUS) |
Publisher Policy: | Reproduced under a Creative Commons License |
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