Weides, M. et al. (2022) 3D Integration of Superconducting Chips with Through Silicon Vias. 35th Integration Symposium on Superconductivity (ISS2022), Nagoya, Japan, 29 Nov - 01 Dec 2022.
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Abstract
No abstract available.
| Item Type: | Conference or Workshop Item |
|---|---|
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Weides, Professor Martin and Nugent, Mr Nicholas and Seferai, Mr Valentino and Grant, Dr James and Paul, Dr Jharna |
| Authors: | Weides, M., Nugent, N., Paul, J., Seferai, V., Grant, J., Hemakumara, T., Shu, Y., Besprozyannyy, D., Renzas, R., Jo, M., and Lindstrom, T. |
| College/School: | College of Science and Engineering > School of Engineering College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering College of Science and Engineering > School of Engineering > James Watt Nanofabrication Centre |
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