Nugent, N., Bronstein, J., Paul, J. , Kennedy, O., Dimitriadis, S., Lindstrom, T., Weides, M. and Connolly, M. (2023) Flip-Chip Integration for Quantum Circuits. Superconducting Quantum Devices in the UK 2023 (SQD2023), Glasgow, UK, 06-07 Jul 2023.
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Abstract
No abstract available.
| Item Type: | Conference or Workshop Item |
|---|---|
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Bronstein, Dr Joe and Weides, Professor Martin and Nugent, Mr Nicholas and Paul, Dr Jharna |
| Authors: | Nugent, N., Bronstein, J., Paul, J., Kennedy, O., Dimitriadis, S., Lindstrom, T., Weides, M., and Connolly, M. |
| College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering College of Science and Engineering > School of Engineering > James Watt Nanofabrication Centre College of Science and Engineering > School of Engineering |
| Related URLs: |
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Deposit and Record Details
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