3D architectural MXene composite films for stealth terahertz shielding performance

Theja, V. C. S., Assi, D. S., Huang, H., Alsulami, R. S., Chen, B. J., Chan, C.-H., Shek, C.-H., Karthikeyan, V. and Roy, V. A. L. (2023) 3D architectural MXene composite films for stealth terahertz shielding performance. Advanced Materials Interfaces, (doi: 10.1002/admi.202300440) (Early Online Publication)

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Abstract

The terahertz frequency range is gaining popularity in security, stealth technology, and the future 6G network communication. For the control of severe terahertz electromagnetic interference (EMI) pollution, frequency-selective stealth-capable shielding materials are being explored to mask terahertz signals. For the realization of masking terahertz signals, the robustness, lightweight, and shape-conformable materials with excellent terahertz EMI shielding/absorption are crucial. Here, the study reports the fabrication of 3D symmetric pyramidal architectural MXene composite films with frequency-selective stealth performance characteristics via the facile drop casting method. With the high absorption capability of 2D MXene layers, the MXene composite films exhibit substantial terahertz stealth performance. 3D pyramidal microstructure design leads to frequency selective surface-assisted reflection resonance in the frequency range of 0.6–1.1 THz. The MXene composite film demonstrates an outstanding maximum terahertz shielding effectiveness (SE) of up to 70.4 dB and a specific SE of 0.55 dB µm−1. These terahertz SE values exceed all of those for MX-based shielding material designs reported in the literature. The investigation will open a new direction toward developing terahertz EMI shielding thin films with easy integration into any surface for stealth capabilities.

Item Type:Articles
Additional Information:The authors acknowledge the support from the Research Grants Council ofHong Kong SAR under the Theme-based Research Scheme (T42-717/20)
Status:Early Online Publication
Refereed:Yes
Glasgow Author(s) Enlighten ID:Karthikeyan, Dr Vaithinathan and Huang, Hongli and Assi, Dani and Vellaisamy, Professor Roy and Alsulami, Raghad Saud M
Authors: Theja, V. C. S., Assi, D. S., Huang, H., Alsulami, R. S., Chen, B. J., Chan, C.-H., Shek, C.-H., Karthikeyan, V., and Roy, V. A. L.
College/School:College of Science and Engineering > School of Engineering
College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Advanced Materials Interfaces
Publisher:Wiley
ISSN:2196-7350
ISSN (Online):2196-7350
Published Online:30 August 2023
Copyright Holders:Copyright: © 2023 The Authors
First Published:First published in Advanced Materials Interfaces 2023
Publisher Policy:Reproduced under a Creative Commons licence

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