Single-material MoS2 thermoelectric junction enabled by substrate engineering

Razeghi, M. et al. (2023) Single-material MoS2 thermoelectric junction enabled by substrate engineering. npj 2D Materials and Applications, 7, 36. (doi: 10.1038/s41699-023-00406-z)

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Abstract

To realize a thermoelectric power generator, typically, a junction between two materials with different Seebeck coefficients needs to be fabricated. Such differences in Seebeck coefficients can be induced by doping, which renders it difficult when working with two-dimensional (2d) materials. However, doping is not the only way to modulate the Seebeck coefficient of a 2d material. Substrate-altered electron–phonon scattering mechanisms can also be used to this end. Here, we employ the substrate effects to form a thermoelectric junction in ultrathin, few-layer MoS2 films. We investigated the junctions with a combination of scanning photocurrent microscopy and scanning thermal microscopy. This allows us to reveal that thermoelectric junctions form across the substrate-engineered parts. We attribute this to a gating effect induced by interfacial charges in combination with alterations in the electron–phonon scattering mechanisms. This work demonstrates that substrate engineering is a promising strategy for developing future compact thin-film thermoelectric power generators.

Item Type:Articles
Additional Information:T.S.K. acknowledges support from TUBITAK under grant no: 121F366.
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Weaver, Professor Jonathan and Dobson, Dr Phil
Authors: Razeghi, M., Spiece, J., Oğuz, O., Pehlivanoğlu, D., Huang, Y., Sheraz, A., Başçı, U., Dobson, P. S., Weaver, J. M.R., Gehring, P., and Kasırga, T. S.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:npj 2D Materials and Applications
Publisher:Nature Research
ISSN:2397-7132
ISSN (Online):2397-7132
Copyright Holders:Copyright © 2023 The Authors
First Published:First published in npj 2D Materials and Applications 7: 36
Publisher Policy:Reproduced under a Creative Commons License

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