Silk nanofibers based soft and degradable capacitive pressure sensor arrays

John, D. A., Parameswaran, C., Sandhu, S. and Dahiya, R. (2023) Silk nanofibers based soft and degradable capacitive pressure sensor arrays. IEEE Sensors Letters, 7(5), 2501104. (doi: 10.1109/LSENS.2023.3270665)

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Highly sensitive pressure sensors with features such as biocompatibility, biodegradability, and flexibility are needed in applications such as robotics, prosthesis, medical implants, and wearable electronics. However, due to material limitations or technological bottlenecks it is often challenging to fabricate pressure sensors with these attributes at the same time. Herein, we present biodegradable silk/PEO/yeast nanofibers based soft capacitive pressure sensor array (2 × 2). The electrospun nanofibers used here have about 150% enhanced crystallinity, as confirmed by X-ray diffraction (XRD) and Fourier Transform- Infrared spectroscopy (FT-IR). The performance metrics of the sensor array, such as sensitivity (∼0.18 kPa -1 ), hysteresis (<16%), minimum response (∼0.8 s), and recovery time (∼1 sec) show its suitability for application such as smart plasters used for accelerated wound healing. Further, the degradability studies confirm the quick degradation of sensors, which can also be potentially controlled with suitable packaging.

Item Type:Articles
Additional Information:Paper also presented at IEEE Fleps 2023, Boston, MA, USA, 09-12 Jul 2023. The work in this letter was initiated by R. Dahiya’s Bendable Electronics and Sensing Technologies (BEST) Group when he was at the University of Glasgow, U.K. The work was completed after he moved to Northeastern University, USA, where his group is known as Bendable Electronics and Sustainable Technologies (BEST) Group. This work was supported in part by the European Commission through the FET-OPEN project Ph-Coding (H2020-FETOPEN-2018- 8291), Heteroprint Programme Grant (EP/R03480X/1) and CHIST-ERA project TESLA (EP/W035790/1).
Glasgow Author(s) Enlighten ID:Dahiya, Professor Ravinder and Sandhu, Dr Sofia and Parameswaran, Dr Chithra and John, Dr Dina
Authors: John, D. A., Parameswaran, C., Sandhu, S., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:IEEE Sensors Letters
ISSN (Online):2475-1472
Published Online:26 April 2023
Copyright Holders:Copyright © 2023 IEEE
First Published:First published in IEEE Sensors Letters 7(5): 2501104
Publisher Policy:Reproduced with the permission of the Publisher

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
301327`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturingPeter SkabaraEngineering and Physical Sciences Research Council (EPSRC)EP/R03480X/1ENG - Electronics & Nanoscale Engineering