Influence of Printed Encapsulation Layer on the Mechanical Reliability and Performance of V₂O₅ Nanowires-Based Flexible Temperature Sensors

Neto, J., Dahiya, A. S. and Dahiya, R. (2023) Influence of Printed Encapsulation Layer on the Mechanical Reliability and Performance of V₂O₅ Nanowires-Based Flexible Temperature Sensors. IEEE Journal on Flexible Electronics, 2(2), pp. 168-174. (doi: 10.1109/JFLEX.2023.3247985)

Abstract

Nanowires (NWs)-based sensors have been studied extensively to measure various physical, chemical, and biological parameters as their large surface-to-volume ratio leads to sensitive devices. Furthermore, due to the low flexural rigidity of NWs, these sensors can be developed on ultraflexible substrates. However, their performance often degrades after repeated mechanical deformations or when they are exposed to different ambient environments. A well-thought-out device engineering step could resolve these issues. As a potential solution, the soft material-based encapsulation layers have been explored. These are suitable for most sensor types except the temperature sensors, where they reduce the efficiency of heat transfer. Addressing this issue, we present here vanadium pentoxide (V 2 O 5 ) NWs-based temperature sensors with nanosilica/epoxy (NS/epoxy)-based encapsulation layer. The encapsulation layer is selectively deposited with high-resolution electrohydrodynamic printing. The comparison of nonencapsulated (N-ES) and encapsulated (ES) devices, after applied mechanical loadings (bending and twisting), shows a robust and reliable temperature sensing performance of the latter. This study shows how the sensing performance can be preserved and the lifetime of flexible temperature sensors elongated by using an encapsulation layer.

• Item Type: Articles
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Dahiya, Dr Abhishek Singh and Neto, Mr Joao and Dahiya, Professor Ravinder
• Authors: Neto, J., Dahiya, A. S., and Dahiya, R.
• College/School: College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• Journal Name: IEEE Journal on Flexible Electronics
• Publisher: IEEE
• ISSN: 2768-167X
• ISSN (Online): 2768-167X
• Published Online: 24 February 2023
• Copyright Holders: Copyright © 2023 IEEE
• First Published: First published in IEEE Journal on Flexible Electronics 2(2): 168-174
• Publisher Policy: Reproduced in accordance with the publisher copyright policy

Project Code	Award No	Project Name	Principal Investigator	Funder's Name	Funder Ref	Lead Dept
301728		Engineering Fellowships for Growth: Printed Tactile SKIN	Ravinder Dahiya	Engineering and Physical Sciences Research Council (EPSRC)	EP/R029644/1	ENG - Electronics & Nanoscale Engineering
301327		`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturing	Peter Skabara	Engineering and Physical Sciences Research Council (EPSRC)	EP/R03480X/1	ENG - Electronics & Nanoscale Engineering