Degradable Nanofibers-based Capacitive Pressure Sensor for Underwater Monitoring

Karagiorgis, X., Beniwal, A. , Skabara, P. and Dahiya, R. (2023) Degradable Nanofibers-based Capacitive Pressure Sensor for Underwater Monitoring. In: IEEE Applied Sensing Conference (IEEE APSCON 2023), Bengaluru, India, 23-25 Jan 2023, ISBN 9781665461634 (doi: 10.1109/APSCON56343.2023.10101231)

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Abstract

This paper presents a degradable nanofibers-based sensor for underwater pressure monitoring applications. The presented capacitive pressure sensor uses polyhydroxy butyrate (PHB) nanofibers as the dielectric material. The sensor is encapsulated in polyimide (PI) to prevent moisture permeation during the operation. The fabricated device is tested in air and water ambient under dynamic and static conditions. The sensor showed a sensitivity of 3.87 kPa−1 with excellent linearity (99.8%) and stability, and low hysteresis of 1.3 %. The fabrication process used here could also be replicated to develop flexible pressure sensors for underwater wearables.

Item Type:Conference Proceedings
Additional Information:This work was supported in part by Engineering and Physical Sciences Research Council through Heteroprint Programme Grant (EP/R03480X/1).
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Karagiorgis, Xenofon and Dahiya, Professor Ravinder and Skabara, Professor Peter and Beniwal, Dr Ajay
Authors: Karagiorgis, X., Beniwal, A., Skabara, P., and Dahiya, R.
College/School:College of Science and Engineering > School of Chemistry
College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
ISBN:9781665461634
Published Online:17 April 2023
Copyright Holders:Copyright © 2023 IEEE
First Published:First published in IEEE Applied Sensing Conference (IEEE APSCON 2023)
Publisher Policy:Reproduced with the permission of the Publisher
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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
301327`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturingPeter SkabaraEngineering and Physical Sciences Research Council (EPSRC)EP/R03480X/1ENG - Electronics & Nanoscale Engineering