Conventional sintered Cu2-xSe thermoelectric material

Geng, Z., Shi, D., Shi, L., Li, Y., Snyder, G. J. and Lam, K.-h. (2019) Conventional sintered Cu2-xSe thermoelectric material. Journal of Materiomics, 5(4), pp. 626-633. (doi: 10.1016/j.jmat.2019.06.005)

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Abstract

As the featured material of the superionic thermoelectric (TE) material family, copper-chalcogenide Cu2-xSe is attracting growing research interest for its excellent TE performance derived from the satisfactory power factor and the ultra-low thermal conductivity induced by the superionic effect. Various efforts have been made and proved to be effective to further enhance the TE performance for Cu2-xSe. However, this material is still far from the application stage, which is mainly due to concerns regarding control of the properties and the costly complex fabrication technology. Here we report a scalable pathway to achieve high-performance and tunable Cu2-xSe, utilizing conventional sintering technology and copper (Cu)-vacancy engineering with an effective mass model. The figure of merit zT is a competitive value of 1.0 at 800 K for the optimized binary Cu2-xSe, based on the precise modeling prediction and Cu-vacancy engineering. The changes in TE properties of Cu2-xSe under heating-cooling cycle tests are also revealed. Our work offers the referable method along with the decent parent material for further enhancement of TE performance, paving a possible route for the application and industrialization of Cu2-xSe TE materials.

Item Type:Articles
Additional Information:This work was funded by The Hong Kong Polytechnic University [grant numbers 1-ZVGH, DD7F].
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Lam, Dr Koko
Authors: Geng, Z., Shi, D., Shi, L., Li, Y., Snyder, G. J., and Lam, K.-h.
College/School:College of Science and Engineering > School of Engineering > Systems Power and Energy
Journal Name:Journal of Materiomics
Publisher:Elsevier
ISSN:2352-8478
ISSN (Online):2352-8478
Published Online:29 June 2019
Copyright Holders:Copyright: © 2019 The Chinese Ceramic Society
First Published:First published in Journal of Materiomics 5(4): 626-633
Publisher Policy:Reproduced under a Creative Commons licence
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