Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

Jevtics, D. et al. (2021) Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing. Optical Materials Express, 11(10), pp. 3567-3576. (doi: 10.1364/OME.432751)

Abstract

The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.

• Item Type: Articles
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Klitis, Dr Charalambos and Sorel, Professor Marc
• Authors: Jevtics, D., Smith, J. A., McPhillimy, J., Guilhabert, B., Hill, P., Klitis, C., Hurtado, A., Sorel, M., Hoe Tan, H., Jagadish, C., Dawson, M. D., and Strain, M. J.
• College/School: College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• Journal Name: Optical Materials Express
• Publisher: Optical Society of America
• ISSN: 2159-3930
• ISSN (Online): 2159-3930
• Published Online: 29 September 2021
• Copyright Holders: Copyright © 2021 The Authors
• First Published: First published in Optical Materials Express 11(10): 3567-3576
• Publisher Policy: Reproduced under a Creative Commons License
• Data DOI: 10.15129/10070904-bb8a-433c-875d-cdd5e6bcda95

Project Code	Award No	Project Name	Principal Investigator	Funder's Name	Funder Ref	Lead Dept
301327		`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturing	Peter Skabara	Engineering and Physical Sciences Research Council (EPSRC)	EP/R03480X/1	ENG - Electronics & Nanoscale Engineering
174169		Parallel Heterogeneous Integration of III-V Devices on Silicon Photonic Chips	Marc Sorel	Engineering and Physical Sciences Research Council (EPSRC)	EP/P013570/1	ENG - Electronics & Nanoscale Engineering
303977		ChipAI	Edward Wasige	European Commission (EC)	828841	ENG - Electronics & Nanoscale Engineering
304171		Superpixel	Martin Lavery	European Commission (EC)	829116	ENG - Electronics & Nanoscale Engineering