Sensorimotor Correlation Using Printed Synaptic Transistors and Conditioning PCB

Liu, F. , Shojaei Baghini, M. , Chakraborty, M. , Christou, A. and Dahiya, R. (2022) Sensorimotor Correlation Using Printed Synaptic Transistors and Conditioning PCB. In: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Vienna, Austria, 10-13 Jul 2022, ISBN 9781665442732 (doi: 10.1109/FLEPS53764.2022.9781594)

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Abstract

The advances in robotics are often inspired by biological systems, which have attained harmonised functionality and efficiency through billions of years of evolution. Motivated by the nature, this paper presents the realisation of sensorimotor correlation using printed synaptic transistor. While such a concept has drawn increasing attention recently, no report on the adopted technology details has been published. To this end, this paper specifically presents the technical elements for the practical realisation of the concept through printed synaptic transistor and the development of the conditioning printed circuit board (PCB) for operating the as-realised device. This work presents a possible roadmap for the future advancement towards e-Skin with neural-like processing capability through a heterogeneous integration of printed circuits on flexible PCBs.

Item Type:Conference Proceedings
Additional Information:This work was supported in part by Engineering and Physical Sciences Research Council through Engineering Fellowship for Growth (EP/R029644/1) and Heteroprint Programme Grant (EP/R03480X/1).
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Shojaei Baghini, Ms Mahdieh and Dahiya, Professor Ravinder and Chakraborty, Dr Moupali and Christou, Mr Adamos and Liu, Mr Fengyuan
Authors: Liu, F., Shojaei Baghini, M., Chakraborty, M., Christou, A., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Research Group:Bendable Electronics and Sensing Technologies
ISBN:9781665442732
Published Online:10 June 2022
Copyright Holders:Copyright © 2022 IEEE
First Published:First published in 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
Publisher Policy:Reproduced in accordance with the copyright policy of the publisher
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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
301728Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/R029644/1ENG - Electronics & Nanoscale Engineering
301327`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturingPeter SkabaraEngineering and Physical Sciences Research Council (EPSRC)EP/R03480X/1ENG - Electronics & Nanoscale Engineering