Multidirectional Strain Sensor Using Multimaterial 3D Printing

Chirila, R., Ozioko, O., Schyns, P. G. and Dahiya, R. (2022) Multidirectional Strain Sensor Using Multimaterial 3D Printing. In: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Vienna, Austria, 10-13 Jul 2022, ISBN 9781665442732 (doi: 10.1109/fleps53764.2022.9781529)

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Abstract

This paper presents a fully 3D printed multidirectional strain sensor for robotic applications. The all-printed sensor constitutes a piezoresistive sensing layer of flexible carbon black engineered thermoplastic polyurethane (PI-ETPU), and a structurally engineered sensor frame printed using rigid polylactic acid (PLA). The sensor is printed using multi-material 3D printing and systematically positioned in the frame to uniquely detect multidirectional mechanical loading. The stress and strain distributions on the developed sensor structure, as well as the piezoresistive coupling of the active sensing layer are investigated using COMSOL Multiphysics. The results show discrete resistive responses over the three different displacements simulated. The unique motion and the response give the individual sensors the ability to infer new pieces of data such as angle and orientation from the piezoresistive behavior of each sensor. This makes the sensors promising for a wide range of applications, from artificially intelligent robots to rehabilitation and 3D texture mapping.

Item Type:Conference Proceedings
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Dahiya, Professor Ravinder and Schyns, Professor Philippe and Ozioko, Mr Oliver and Chirila, Mr Radu-Razvan
Authors: Chirila, R., Ozioko, O., Schyns, P. G., and Dahiya, R.
College/School:College of Medical Veterinary and Life Sciences > School of Psychology & Neuroscience
College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
Publisher:IEEE
ISBN:9781665442732
Published Online:10 June 2022
Copyright Holders:Copyright © 2022 IEEE
First Published:First published in 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
Publisher Policy:Reproduced in accordance with the copyright policy of the publisher

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
303764EPSRC CDT - Socially Intelligent Artificial AgentsAlessandro VinciarelliEngineering and Physical Sciences Research Council (EPSRC)EP/S02266X/1Computing Science
301728Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/R029644/1ENG - Electronics & Nanoscale Engineering