Influence of Encapsulation on the Performance of V₂O₅ Nanowires-Based Temperature Sensors

Neto, J., Dahiya, A. S. and Dahiya, R. (2022) Influence of Encapsulation on the Performance of V₂O₅ Nanowires-Based Temperature Sensors. In: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Vienna, Austria, 10-13 Jul 2022, ISBN 9781665442732 (doi: 10.1109/FLEPS53764.2022.9781483)

Abstract

Nanowires (NWs) based sensors have been explored extensively to measure various physical, chemical, and biological parameters as their large surface-to-volume ratio leads to sensitive devices. Further, these sensors can be developed on ultra-flexible substrates. However, often their performance degrades under mechanical bending or when they are exposed to the ambient environment. This could be prevented with suitable encapsulation in most types of the sensors, except the one for temperature sensing where the encapsulation could reduce the efficiency of heat transfer. Addressing this issue, we present here vanadium pentoxide (V2O5) NWs based temperature sensors with nanosilica/epoxy (NS/epoxy) based encapsulation layer. The encapsulation layer is deposited with high resolution electrohydrodynamic printing. The comparison of non-encapsulated and encapsulated devices shows a robust and reliable temperature sensing performance from the later. This study shows how the sensing performance can be preserved and the lifetime of flexible sensors elongated by using an encapsulation layer.

• Item Type: Conference Proceedings
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Dahiya, Dr Abhishek Singh and Neto, Mr Joao and Dahiya, Professor Ravinder
• Authors: Neto, J., Dahiya, A. S., and Dahiya, R.
• College/School: College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• ISBN: 9781665442732
• Published Online: 10 June 2022

Project Code	Award No	Project Name	Principal Investigator	Funder's Name	Funder Ref	Lead Dept
301728		Engineering Fellowships for Growth: Printed Tactile SKIN	Ravinder Dahiya	Engineering and Physical Sciences Research Council (EPSRC)	EP/R029644/1	ENG - Electronics & Nanoscale Engineering
301327		`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturing	Peter Skabara	Engineering and Physical Sciences Research Council (EPSRC)	EP/R03480X/1	ENG - Electronics & Nanoscale Engineering