Hybrid integration of screen-printed RFID tags and rigid microchip on paper

Chakraborty, M. , Nikbakhtnasrabadi, F. and Dahiya, R. (2022) Hybrid integration of screen-printed RFID tags and rigid microchip on paper. IEEE Journal on Flexible Electronics, 1(2), pp. 107-113. (doi: 10.1109/JFLEX.2022.3165515)

[img] Text
268392.pdf - Accepted Version

1MB

Abstract

Hybrid or heterogenous integration of silicon technologies and printed electronics is a promising approach for high-performance flexible electronics. It is essentially the integration of rigid microchips with the printed circuit on a flexible substrate. However, microchips with no-lead and mm size pitch introduce practical challenges in terms of precise electrical bonding onto the printed pattern. The differences in mechanical and thermal requirements also make it challenging to use conventional bonding and interconnect technology to robustly connect the microchips on flexible substrates. The focus of this work is to present these challenges with respect to different substrate-adhesive combinations and to provide a facile technique for integrating NFC microchips on different flexible substrates. Following the successful integration, the smart tags were characterised to demonstrate reliable performance in the NFC reading range. Whilst presenting a hybrid integration for the smart tag, this work also shows a potential solution for several other applications of flexible electronics where high-performance cannot be achieved by printed electronics alone.

Item Type:Articles
Additional Information:This work was supported by North West Centre for Advanced Manufacturing (NWCAM) project, supported by the European Union’s INTERREG VA Programme (H2020- Intereg-IVA5055), managed by the Special EU Programmes Body (SEUPB).
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Nikbakhtnasrabadi, Dr Fatemeh and Dahiya, Professor Ravinder and Chakraborty, Dr Moupali
Authors: Chakraborty, M., Nikbakhtnasrabadi, F., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:IEEE Journal on Flexible Electronics
Publisher:IEEE
ISSN:2768-167X
ISSN (Online):2768-167X
Published Online:07 April 2022
Copyright Holders:Copyright © 2021 IEEE
First Published:First published in IEEE Journal on Flexible Electronics 1(2): 107-113
Publisher Policy:Reproduced in accordance with the publisher copyright policy

University Staff: Request a correction | Enlighten Editors: Update this record