Flexible tactile sensors using AlN and MOSFETs based ultra-thin chips

Ma, S., Kumaresan, Y. , Dahiya, A. S. , Lorenzelli, L. and Dahiya, R. (2022) Flexible tactile sensors using AlN and MOSFETs based ultra-thin chips. IEEE Sensors Journal, (doi: 10.1109/JSEN.2022.3140651) (Early Online Publication)

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This paper presents ultrathin chips (UTCs) based flexible tactile sensing system for dynamic contact pressure measurement. The device comprises of an AlN piezocapacitor based UTCs tightly coupled with another UTCs having metal-oxide-semiconductor field-effect transistors (MOSFETs). In this arrangement the AlN piezocapacitor forms the extended gate of MOSFETs. Both AlN piezocapacitor and MOSFET based UTCs are obtained by post-process reduction of wafer thicknesses to ~35μm using backside lapping. The performances of both UTCs were evaluated both before and after thinning and there was no noticeable performance degradation. The UTC-based AlN piezocapacitor exhibited six times higher sensitivity (43.79mV/N) than the thin filmbased AlN sensors. When coupled with MOSFETs based UTC, the observed sensitivity was 0.43N-1. The excellent performance, flexible form factor and compactness shows the potential of presented device in applications such minimal invasive surgical instruments where high-resolution tactile feedback is much needed.

Item Type:Articles
Status:Early Online Publication
Glasgow Author(s) Enlighten ID:Ma, Sihang and Dahiya, Dr Abhishek Singh and Dahiya, Professor Ravinder and Kumaresan, Dr Yogeenth
Authors: Ma, S., Kumaresan, Y., Dahiya, A. S., Lorenzelli, L., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:IEEE Sensors Journal
ISSN (Online):1558-1748
Published Online:07 January 2022
Copyright Holders:Copyright © 2021 IEEE
First Published:First published in IEEE Sensors Journal 2022
Publisher Policy:Reproduced in accordance with the publisher copyright policy

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
301728Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/R029644/1ENG - Electronics & Nanoscale Engineering
301327`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturingPeter SkabaraEngineering and Physical Sciences Research Council (EPSRC)EP/R03480X/1ENG - Electronics & Nanoscale Engineering