Ultra-thin chips with printed interconnects on flexible foils

Ma, S., Kumaresan, Y. , Dahiya, A. S. and Dahiya, R. (2022) Ultra-thin chips with printed interconnects on flexible foils. Advanced Electronic Materials, 8(5), 2101029. (doi: 10.1002/aelm.202101029)

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“Heterogeneous Integration” is a promising approach for high-performance hybrid flexible electronics that combine printed electronics and silicon technology. Despite significant progresses made by integrating rigid silicon chips on flexible substrates, the integration of flexible ultra-thin chips (UTCs) on flexible foils remains a challenge as they are too fragile for conventional bonding methods. Reliable interconnects (low-resistivity and mechanical robustness) and bonding of UTCs are critical to the realization of hybrid flexible systems. Herein, using a non-contact printing approach, an easy and cost-effective method for accessing UTCs on flexible foils is demonstrated. The high-viscosity conductive paste, extruded from a high-resolution printer (1–10 µm line width), is used here to connect the metal oxide semiconductor field effect transistors (MOSFETs) on UTCs with the extended pads on flexible printed circuit boards (PCBs). The electrical characterization of MOSFETs, before and after printing the interconnects, reveals an acceptable level of variation in device mobility (change from 780 to 630 cm2 V−1s−1). This is due to the drop in effective drain bias voltage as a marginally small electrical resistance (≈30 Ω) is added by the printed interconnects. The bonded UTCs show robust device performance under bending conditions, indicating high reliability of both the chip thinning and bonding methods.

Item Type:Articles
Additional Information:This work was supported in part by European Commission through FET-OPEN project Ph-Coding (H2020-FETOPEN-2018-829186) and Engineering and Physical Sciences Research Council (EPSRC) through Engineering Fellowship for Growth (EP/R029644/1) and Hetero-print Programme Grant (EP/R03480X/1).
Glasgow Author(s) Enlighten ID:Ma, Sihang and Dahiya, Dr Abhishek Singh and Dahiya, Professor Ravinder and Kumaresan, Dr Yogeenth
Authors: Ma, S., Kumaresan, Y., Dahiya, A. S., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Advanced Electronic Materials
ISSN (Online):2199-160X
Published Online:30 December 2021
Copyright Holders:Copyright © 2021 The Authors
First Published:First published in Advanced Electronic Materials 8(5) 2101029
Publisher Policy:Reproduced under a Creative Commons licence

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
301728Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/R029644/1ENG - Electronics & Nanoscale Engineering
301327`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturingPeter SkabaraEngineering and Physical Sciences Research Council (EPSRC)EP/R03480X/1ENG - Electronics & Nanoscale Engineering
304237Predictive Haptic COding Devices In Next Generation interfacesRavinder DahiyaEuropean Commission (EC)829186ENG - Electronics & Nanoscale Engineering