Nassar, H. and Dahiya, R. (2021) Fused deposition modeling based 3D printed electrical interconnects and circuits. Advanced Intelligent Systems, 3(12), 2100102. (doi: 10.1002/aisy.202100102)
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Abstract
Multimaterial 3D printing in electronics is expanding due to the ability to realize geometrically complex systems with simplified processes compared with conventional printed circuit board. Herein, the feasibility of using a copper-based filament to realize 3D circuits with planar and vertical interconnections is presented. The resistivity of the tracks (1–3 mm wide) is studied with reference to printing parameters and orientation. Using lateral infill for 1 mm tracks offers lower resistance compared with longitudinal infill (≈75%). For wider tracks, the effect of infill orientation on resistance diminishes. The evaluation of tracks embedded in polylactic acid shows a drop in maximum current (to ≈11 mA) compared with exposed tracks (≈16 mA). There is no observed correlation between electrical performance and number of embedding layers. However, a significant correlation is observed between the tracks’ resistance and the amount of time the filament remains in the heated nozzle. This in-depth study leads to optimum resolution to realize conductive tracks of 0.67 mm thickness and the first integration of fused deposition modeling (FDM)-printed conductive traces with small-outline integrated circuits to open a pathway for higher-density 3D printed circuits. Finally, the transmission of digital data by a 3D printed circuit is demonstrated.
| Item Type: | Articles |
|---|---|
| Additional Information: | This work was supported by Engineering and Physical Sciences Research Council through Engineering Fellowship for Growth - neuPRINTSKIN (EP/R029644/1), Hetero-print Programme Grant (EP/R03480X/1) and IAA grant (EP/R511705/1). |
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Dahiya, Professor Ravinder and Nassar, Mr Habib |
| Authors: | Nassar, H., and Dahiya, R. |
| College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
| Journal Name: | Advanced Intelligent Systems |
| Publisher: | Wiley |
| ISSN: | 2640-4567 |
| ISSN (Online): | 2640-4567 |
| Published Online: | 27 September 2021 |
| Copyright Holders: | Copyright © 2021 The Authors |
| First Published: | First published in Advanced Intelligent Systems, 3(12): 2100102 |
| Publisher Policy: | Reproduced under a Creative Commons licence |
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