Fused deposition modeling based 3D printed electrical interconnects and circuits

Nassar, H. and Dahiya, R. (2021) Fused deposition modeling based 3D printed electrical interconnects and circuits. Advanced Intelligent Systems, 3(12), 2100102. (doi: 10.1002/aisy.202100102)

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Multimaterial 3D printing in electronics is expanding due to the ability to realize geometrically complex systems with simplified processes compared with conventional printed circuit board. Herein, the feasibility of using a copper-based filament to realize 3D circuits with planar and vertical interconnections is presented. The resistivity of the tracks (1–3 mm wide) is studied with reference to printing parameters and orientation. Using lateral infill for 1 mm tracks offers lower resistance compared with longitudinal infill (≈75%). For wider tracks, the effect of infill orientation on resistance diminishes. The evaluation of tracks embedded in polylactic acid shows a drop in maximum current (to ≈11 mA) compared with exposed tracks (≈16 mA). There is no observed correlation between electrical performance and number of embedding layers. However, a significant correlation is observed between the tracks’ resistance and the amount of time the filament remains in the heated nozzle. This in-depth study leads to optimum resolution to realize conductive tracks of 0.67 mm thickness and the first integration of fused deposition modeling (FDM)-printed conductive traces with small-outline integrated circuits to open a pathway for higher-density 3D printed circuits. Finally, the transmission of digital data by a 3D printed circuit is demonstrated.

Item Type:Articles
Additional Information:This work was supported by Engineering and Physical Sciences Research Council through Engineering Fellowship for Growth - neuPRINTSKIN (EP/R029644/1), Hetero-print Programme Grant (EP/R03480X/1) and IAA grant (EP/R511705/1).
Glasgow Author(s) Enlighten ID:Dahiya, Professor Ravinder and Nassar, Mr Habib
Authors: Nassar, H., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Advanced Intelligent Systems
ISSN (Online):2640-4567
Published Online:27 September 2021
Copyright Holders:Copyright © 2021 The Authors
First Published:First published in Advanced Intelligent Systems, 3(12): 2100102
Publisher Policy:Reproduced under a Creative Commons licence

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
301728Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/R029644/1ENG - Electronics & Nanoscale Engineering
301327`Hetero-print: A holistic approach to transfer-printing for heterogeneous integration in manufacturingPeter SkabaraEngineering and Physical Sciences Research Council (EPSRC)EP/R03480X/1ENG - Electronics & Nanoscale Engineering
304896EPSRC-IAA: Early Stage Commercialisation of a PET Imaging Agent for the Detection of Cardiovascular Disease and CancerAndrew SutherlandEngineering and Physical Sciences Research Council (EPSRC)EP/R511705/1Chemistry