Flexible strain and temperature sensing NFC tag for smart food packaging applications

Escobedo, P. , Bhattacharjee, M. , Nikbakhtnasrabadi, F. and Dahiya, R. (2021) Flexible strain and temperature sensing NFC tag for smart food packaging applications. IEEE Sensors Journal, 21(23), pp. 26406-26414. (doi: 10.1109/JSEN.2021.3100876)

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This paper presents a smart sensor patch with flexible strain sensor and a printed temperature sensor integrated with a Near Field Communication (NFC) tag to detect strain or temperature in a semi-quantitative way. The strain sensor is fabricated using conductive polymer poly (3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) in a polymer Polydimethylsiloxane microchannel. The temperature sensor is fabricated by printing silver electrodes and PEDOT:PSS on a flexible polyvinyl chloride (PVC) substrate. A customdeveloped battery-less NFC tag with an LED indicator is used to visually detect the strain or temperature by modulating the LED light intensity. The LED shows maximum brightness for relaxed or no strain condition, and also in the case of maximum temperature. In contrast, the LED is virtually off for the maximum strain condition and for room temperature. Both these could be related to food spoilage. Swollen food packages can be detected with the strain sensor, serving as beacons of microbial contamination. Temperature deviations can result in the growth or survival of food-spoilage bacteria. Based on this, the potential application of the sensor system for smart food packaging is presented.

Item Type:Articles
Glasgow Author(s) Enlighten ID:Nikbakhtnasrabadi, Dr Fatemeh and Bhattacharjee, Mr Mitradip and Escobedo, Dr Pablo and Dahiya, Professor Ravinder
Authors: Escobedo, P., Bhattacharjee, M., Nikbakhtnasrabadi, F., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:IEEE Sensors Journal
ISSN (Online):1558-1748
Published Online:30 July 2021
Copyright Holders:Copyright © 2021 The Authors
First Published:First published in IEEE Sensors Journal 21(23): 26406-26414
Publisher Policy:Reproduced under a Creative Commons License

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
301728Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/R029644/1ENG - Electronics & Nanoscale Engineering