Fenu, N. G. , Li, X. , Lucas, M. and Cochran, S. (2020) Evaluation of PIC 181 and Mn:PIN-PMN-PT Thickness Extensional Rings for Use in Power Ultrasonic Devices for Minimally Invasive Surgery. In: IEEE International Ultrasonics Symposium (IUS 2020), Online, 07-11 Sep 2020, ISBN 9781728154480 (doi: 10.1109/IUS46767.2020.9251369)
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Abstract
High-Q PIC 181 hard piezoceramic and high-k Mn:PIN-PMN-PT piezocrystal thickness extensional rings have been compared for use in the actuation of an ultrasonic scalpel for robotic endo-surgery. Measured material properties have been verified with both finite element analysis and laser vibrometry, to assess the materials' suitability for high power devices. Measured material properties have been verified with both finite element analysis and laser vibrometry, to assess material's suitability for high power devices. Measurements have shown a kt=0.25 and Qm=2200 , and kt=0.62 and Qm=1100 , for PIC 181 and Mn:PIN-PMN-PT respectively. Conventional bolted Langevin-style transducers (BLTs) have been successfully designed and built to resonate at 20 kHz for both piezomaterials. Modal parameters and performance have been modelled in FEA and measured via laser doppler vibrometry. When devices were excited with 50 Vrms at L1 a displacement of: 8 μm and 7 μm was measured for PIC-181 and Mn:PIN-PMN-PT BLTs respectively. Results suggest that a similar resonant frequency can be achieved with a shorter and equally functional device excited by Mn:PIN-PMN-PT piezocrystals.
| Item Type: | Conference Proceedings |
|---|---|
| Status: | Published |
| Refereed: | Yes |
| Glasgow Author(s) Enlighten ID: | Cochran, Professor Sandy and Lucas, Professor Margaret and Fenu, Dr Nicola and Li, Dr Xuan |
| Authors: | Fenu, N. G., Li, X., Lucas, M., and Cochran, S. |
| College/School: | College of Science and Engineering > School of Engineering > Systems Power and Energy |
| ISSN: | 1948-5727 |
| ISBN: | 9781728154480 |
| Copyright Holders: | Copyright © 2020 IEEE |
| First Published: | First published in 2020 IEEE International Ultrasonics Symposium (IUS) |
| Publisher Policy: | Reproduced in accordance with the publisher copyright policy |
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