FPGA-based embedded cyber-physical platform to assess gait and postural stability in Parkinson’s disease

De Venuto, D., Annese, V. F. , Mezzina, G. and Defazio, G. (2018) FPGA-based embedded cyber-physical platform to assess gait and postural stability in Parkinson’s disease. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 8(7), pp. 1167-1179. (doi: 10.1109/tcpmt.2018.2810103)

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Abnormal gait and postural instability are common disorders in people affected by Parkinson's disease (PD). This paper proposes an embedded cyber-physical system for the identification and the real-time extraction of highly selective diagnostic indexes for PD patients. A noninvasive wearable and wireless architecture for both gait analysis and postural instability detection has been proposed and implemented on a programmable hardware. The combined analysis of electroencephalography and electromyography allows studying the motor cortex activity through the movement-related potentials, determining a novel set of indexes that could be used for the PD diagnosis and classification. In a future perspective of an application-specific integrated circuit implementation, the real-time data processing has been fully realized on the Altera Cyclone V field-programmable gate array (FPGA), without interactions with embedded processor architecture. Referring to an Altera Cyclone V SE 5CSEMA5F31C6N device, the whole implemented architecture exploits 90% of the available FPGA adaptive logic modules, 74% of the manageable registers, and 10.3% of the total memory, as well as 29.7% wires utilization. Furthermore, the system is able to provide the outputs in about 57 ms with a dynamically power dissipation of 89 mW. The platform has been tested in vivo on two Parkinson's patients and two healthy subjects (control group) covering three typical diagnostic scenarios: PD versus controls, drug treatment evaluation, and involuntary movements detection.

Item Type:Articles
Glasgow Author(s) Enlighten ID:Annese, Dr Valerio
Authors: De Venuto, D., Annese, V. F., Mezzina, G., and Defazio, G.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:IEEE Transactions on Components, Packaging, and Manufacturing Technology
Publisher:Institute of Electrical and Electronics Engineers
ISSN (Online):2156-3950
Published Online:21 March 2018

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