Flexible Wirelessly Powered Implantable Device

Galeote-Checa, G., Uke, K., Sohail, L., Das, R. and Heidari, H. (2020) Flexible Wirelessly Powered Implantable Device. In: 26th IEEE International Conference on Electronics Circuits and Systems (ICECS 2019), Genova, Italy, 27-29 Nov 2019, pp. 891-894. ISBN 9781728109961 (doi: 10.1109/ICECS46596.2019.8964995)

[img] Text
197559.pdf - Accepted Version



Brain implantable devices have various limitations in terms of size, power, biocompatibility and mechanical properties that need to be addressed. This paper presents a neural implant that is powered wirelessly using a flexible biocompatible antenna. This delivers power to an LED at the end of the shaft to provide a highly efficient demonstration. The proposed design in this study combines mechanical properties and practicality given the numerous constraints of this implant typology. We have applied a modular structure approach to the design of this device considering three modules of antenna, conditioner circuit and shank. The implant was fabricated using a flexible substrate of Polyimide and encapsulated by PDMS for chronic implantation. In addition, finite element method COMSOL Multiphysics simulation of mechanical forces acting on the implant and shank was carried out to validate a viable shank conformation-encapsulation combination that will safely work under operational stress with a satisfactory margin of safety.

Item Type:Conference Proceedings
Glasgow Author(s) Enlighten ID:Das, Dr Rupam and Heidari, Professor Hadi
Authors: Galeote-Checa, G., Uke, K., Sohail, L., Das, R., and Heidari, H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Copyright Holders:Crown Copyright © 2019
Publisher Policy:Reproduced in accordance with the copyright policy of the publisher
Related URLs:

University Staff: Request a correction | Enlighten Editors: Update this record

Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
303466HERMESHadi HeidariEuropean Commission (EC)824164ENG - Electronics & Nanoscale Engineering