Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects

Uhlig, B. et al. (2018) Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects. In: 2018 IEEE International Interconnect Technology Conference (IITC), Santa Clara, CA, USA, 4-7 Jun 2018, pp. 16-18. ISBN 9781538643372 (doi: 10.1109/IITC.2018.8430411)

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Here, we review and present current challenges and progress on Carbon Nanotube Integration for BEOL Interconnects as well as our recent results. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) improvement of the variability of SWCNTs for local interconnects 2) process & growth of carbon nanotube interconnects compatible with BEOL integration and formation of CNT-copper-composites, 3) modeling and simulation from atomistic to circuit-level benchmarking and performance prediction, and 4) characterization and electrical measurements. The aim is to evaluate the use of CNT-based materials for future metallization, both in regards to manufacturability, i.e. CMOS compatibility and wafer-scale integration as well as realistic performance expectations, i.e. variability and defectivity.

Item Type:Conference Proceedings
Glasgow Author(s) Enlighten ID:Lee, Mr James and Amoroso, Dr Salvatore and Wang, Dr Liping and Georgiev, Professor Vihar
Authors: Uhlig, B., Dhavamani, A., Nagy, N., Lilienthal, K., Liske, R., Ramos, R., Dijon, J., Okuno, H., Kalita, D., Lee, J., Georgiev, V., Asenov, A., Amoroso, S., Wang, L., Koenemann, F., Gotsmann, B., Goncalves, G., Chen, B., Liang, J., Pandey, R. R., Chen, R., and Todri-Sanial, A.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Copyright Holders:Copyright © 2018 IEEE
Publisher Policy:Reproduced in accordance with the copyright policy of the publisher

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
701891CONNECTAsen AsenovEuropean Commission (EC)688612ENG - ENGINEERING ELECTRONICS & NANO ENG