A Compact Wearable System for Detection and Estimation of Open Wound Status In Diabetic Patient

Yuan, Z., Huang, J., Zao, Z., Zahid, A., Heidari, H. , Ghannam, R. and Abbasi, Q. H. (2019) A Compact Wearable System for Detection and Estimation of Open Wound Status In Diabetic Patient. In: IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia 2018), Chengdu, China, 26-30 Oct 2018, pp. 60-63. ISBN 9781538695913 (doi: 10.1109/PRIMEASIA.2018.8598064)

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Abstract

In this paper, a new smart health embedded system that can notify users the status of an open wound to assure correct cicatrisation in real-time for ulcer foot in diabetes prevention has been designed. Specifically, this system monitors the healing process through the saturation of exudate in the absorbent dressing and the pathogen of infection by estimating the top gas of wound based on the various bacteria's metabolites. The collected information has been transmitted on portable devices in real time to inform the patient the current condition of wound and give advice. Finally, the algorithm of diabetes wound healing process is explored in this work, which can also be applied for related medical research in the diabetes preventions. The measurement results have an error of 0.9% and 2.3%, respectively for temperature and humidity in detection of cicatrisation. In the evaluation of pathogen of wound infection, the error of predicting the concentration of different gases (Sulfo-compound, Ethanol and Aldehyde) was only 2.8%.

Item Type:Conference Proceedings
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Ghannam, Professor Rami and Zahid, Mr Adnan and Heidari, Professor Hadi and Abbasi, Professor Qammer
Authors: Yuan, Z., Huang, J., Zao, Z., Zahid, A., Heidari, H., Ghannam, R., and Abbasi, Q. H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
ISSN:2159-2160
ISBN:9781538695913
Published Online:03 January 2019
Copyright Holders:Copyright © 2018 IEEE
First Published:First published in IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia 2018): 60-63
Publisher Policy:Reproduced in accordance with the publisher copyright policy

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