Ultrasonic Arrays for Flaw Characterization at High Temperature

McNab, A., Hayward, G., Cochran, A. , Hall, I.D. and Kirk, K.J. (1997) Ultrasonic Arrays for Flaw Characterization at High Temperature. In: Review of Progress in Quantitative Nondestructive Evaluation 16, Brunswick, ME, USA, 28 Jul - 02 Aug 1996, pp. 943-950. ISBN 9781461559474 (doi: 10.1007/978-1-4615-5947-4_123)

Abstract

There is a real and increasing need to monitor the presence and growth of cracks in key regions of plant within the nuclear, gas and chemical industries [1]. A rugged, permanently attached sensor, capable of operating at temperatures in excess of 400° C, would have substantial benefits, since it would reduce the down-time costs incurred through the forced inspection of known or suspected flaws. By carefully measuring crack growth in-situ, under plant operating conditions, remedial action can be taken, either during planned outages of the plant, or when the crack depth exceeds critical limits.

• Item Type: Conference Proceedings
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Cochran, Professor Sandy and Kirk, Dr Katherine
• Authors: McNab, A., Hayward, G., Cochran, A., Hall, I.D., and Kirk, K.J.
• College/School: College of Science and Engineering > School of Engineering > Systems Power and Energy; College of Science and Engineering > School of Physics and Astronomy
• ISBN: 9781461559474