Webster, R.A., Button, T.W., Meggs, C., MacLennan, D. and Cochran, S. (2007) P3K-5 Passive Materials for High Frequency Ultrasound Components. In: 2007 IEEE International Ultrasonics Symposium (IUS), New York, NY, USA, 28-31 Oct 2007, pp. 1925-1928. ISBN 9781424413836 (doi: 10.1109/ULTSYM.2007.484)
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Abstract
This study reports the design of materials suitable for backing in piezocomposite devices specifically operating at frequencies above 30MHz. Tungsten loaded epoxy backing samples were made with varying volume fractions with l-5 mum tungsten powder and RX771/HY1300 epoxy. Higher volume fractions were achieved with high shear milling exploiting a new material fabrication technology using PVB polymer, without the need for pressing. Acoustic measurements were carried out at 36MHz to characterise the samples for use in both single element transducers and arrays. The variation in longitudinal and shear wave velocities and acoustic impedance follow the Devaney scattering model with the acoustic impedance ranging from 3-15MRayls. The results show that this material is suitable for use as backing in high frequency piezocomposite devices and acoustic properties can be tailored by adjusting the volume fraction of tungsten.
Item Type: | Conference Proceedings |
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Status: | Published |
Refereed: | Yes |
Glasgow Author(s) Enlighten ID: | Cochran, Professor Sandy |
Authors: | Webster, R.A., Button, T.W., Meggs, C., MacLennan, D., and Cochran, S. |
College/School: | College of Science and Engineering > School of Engineering > Systems Power and Energy |
ISSN: | 1051-0117 |
ISBN: | 9781424413836 |
Published Online: | 26 December 2007 |
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