Wire bond free connection of high frequency piezoelectric ultrasound transducer arrays

University Of Dundee, Heriot Watt University (2011) Wire bond free connection of high frequency piezoelectric ultrasound transducer arrays. .

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Publisher's URL: https://patents.google.com/patent/WO2011033271A1

Abstract

A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component.

Item Type:Patents
Additional Information:Publication Number: WO2011033271A1.
International Application Number: PCT/GB2010/001764.
Status:Published
Glasgow Author(s) Enlighten ID:Cochran, Professor Sandy
Authors: Bernasseau, A., Hutson, D., Cochran, S., and Desmulliez, M. P. Y.
College/School:College of Science and Engineering > School of Engineering > Systems Power and Energy
First Published:24 March 2011

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