University Of Dundee, Heriot Watt University (2011) Wire bond free connection of high frequency piezoelectric ultrasound transducer arrays. .
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Publisher's URL: https://patents.google.com/patent/WO2011033271A1
Abstract
A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component.
Item Type: | Patents |
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Additional Information: | Publication Number: WO2011033271A1.
International Application Number: PCT/GB2010/001764. |
Status: | Published |
Glasgow Author(s) Enlighten ID: | Cochran, Professor Sandy |
Authors: | Bernasseau, A., Hutson, D., Cochran, S., and Desmulliez, M. P. Y. |
College/School: | College of Science and Engineering > School of Engineering > Systems Power and Energy |
First Published: | 24 March 2011 |
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