Ultrasonic thin film transducers for high-temperature NDT

Kirk, K.J., Lee, C.K. and Cochran, S. (2005) Ultrasonic thin film transducers for high-temperature NDT. Insight: The Journal of the British Institute of Non-destructive Testing, 47(2), pp. 85-87. (doi: 10.1784/insi.47.2.85.58980)

Abstract

Ultrasonic thin films have advantages over conventional transducers for non-destructive testing, especially at high temperatures. We have demonstrated thin film ultrasonic devices in operation at temperatures over 400°C. Pulse-echo and through-transmission modes have been used, with standard ultrasonic pulser-receivers. The films are deposited directly onto the test components, thus eliminating problems with acoustic coupling at high temperatures. Transducers formed in this way are low-profile, unlike water-cooled transducers or those requiring thermal isolation via buffer rods. It is possible to deposit the films onto curved surfaces and extensive surface preparation is not required. Pulse-echo tests have been carried out on aluminium and mild steel components, showing that back-wall echoes and simulated defects can be detected through several centimetres of material. There are clearly important potential applications in non-destructive testing at high temperatures including detection of defects in hot components and monitoring pipewall thickness in high-temperature plant.

• Item Type: Articles
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Cochran, Professor Sandy
• Authors: Kirk, K.J., Lee, C.K., and Cochran, S.
• College/School: College of Science and Engineering > School of Engineering > Systems Power and Energy
• Journal Name: Insight: The Journal of the British Institute of Non-destructive Testing
• Publisher: British Institute of Non-Destructive Testing
• ISSN: 13542575