Surface micromachining of a thin film microresonator using dry decomposition of a polymer sacrificial layer

Patil, S.B. , Chu, V. and Conde, J. P. (2007) Surface micromachining of a thin film microresonator using dry decomposition of a polymer sacrificial layer. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 25(2), 455. (doi: 10.1116/1.2715972)

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Abstract

Fabrication of thin film silicon bridge microresonators on glass substrates using an unzipping sacrificial polymer has been demonstrated. Polynorbornene, which can be thermally decomposed at ∼425°C∼425°C, has been used as the sacrificial layer, allowing a simple, fully dry sacrificial layer removal. The polynorbornene is spin coated onto the substrate and patterned by photolithography. A thin film silicon structural layer is deposited by rf plasma-enhanced chemical vapor deposition and patterned to form a microbridge. The microbridges are electrostatically actuated and the resulting deflection is measured optically. The fabricated microbridges show resonance frequencies of the order of ∼4.4MHz∼4.4MHz and quality factors ∼450∼450.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Patil, Dr Samadhan
Authors: Patil, S.B., Chu, V., and Conde, J. P.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Publisher:AIP Publishing
ISSN:1071-1023
ISSN (Online):1520-8567
Published Online:26 March 2007

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