Hybrid Structure of Stretchable Interconnect for Reliable E-skin Application

Dang, W., Lorenzelli, L., Vinciguerra, V. and Dahiya, R. (2017) Hybrid Structure of Stretchable Interconnect for Reliable E-skin Application. In: 2017 IEEE 26th International Symposium on Industrial Electronics, Edinburgh, UK, 19-21 Jun 2017, pp. 2093-2096. ISBN 9781509014125 (doi: 10.1109/ISIE.2017.8001579)

Abstract

This paper presents the methodology for realisation of stretchable interconnects based on hybrid thin film stack of spray-coated conductive polymer PEDOT: PSS and evaporated gold (Au) film. The PEDOT: PSS film, with its properties in electrical conductivity and mechanical softness, serves as a stress release buffer in the layered hybrid structure. With the serpentine-shape design, the stretchable interconnects can accommodate larger deformation in comparison with a straight line. The correlation between interconnects' morphology (i.e. cracks propagation) with their electrical behaviour has been studied through microscope in along with electrical characterisation under external strain. Furthermore, a comparison in failure strain among different serpentine-shaped designs has been studied. Higher level in stretchability of interconnects can be achieved with a larger arc degree in design. The fabricated stretchable interconnects can accommodate significant deformations up to 72% external strain while maintaining electrically conductive.

• Item Type: Conference Proceedings
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Dahiya, Professor Ravinder and Dang, Ms Wenting
• Authors: Dang, W., Lorenzelli, L., Vinciguerra, V., and Dahiya, R.
• College/School: College of Science and Engineering > School of Engineering; College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• ISSN: 2163-5145
• ISBN: 9781509014125
• Published Online: 08 August 2017
• Copyright Holders: Copyright © 2017 IEEE
• Publisher Policy: Reproduced in accordance with the copyright policy of the publisher

Project Code	Award No	Project Name	Principal Investigator	Funder's Name	Funder Ref	Lead Dept
68214	1	CONTEST	Ravinder Dahiya	European Commission (EC)	317488	ENG - ENGINEERING ELECTRONICS & NANO ENG
66386	1	Engineering Fellowships for Growth: Printed Tactile SKIN	Ravinder Dahiya	Engineering and Physical Sciences Research Council (EPSRC)	EP/M002527/1	ENG - ENGINEERING ELECTRONICS & NANO ENG