Nanomaterials Processing for Flexible Electronics

Shakthivel, D., Liu, F. , García Núñez, C. , Taube, W. and Dahiya, R. (2017) Nanomaterials Processing for Flexible Electronics. In: 2017 IEEE 26th International Symposium on Industrial Electronics, Edinburgh, UK, 19-21 Jun 2017, pp. 2102-2106. ISBN 9781509014125 (doi: 10.1109/ISIE.2017.8001581)

149759.pdf - Accepted Version



Inorganic nanomaterials such as nanowires (NWs) and nanotubes (NTs) are explored for future flexible electronics applications due to their attributes such as high aspect ratio, enhanced surface-to-volume ratio, prominent mobility and ability to integrate on non-conventional substrates. Device performance of semiconducting NWs are demonstrated to be superior compared to the organic counterparts. Among the synthesis methods, bottom-up vapour-liquid-solid (VLS) growth mechanism playing central role for preparing wide variety of high crystal quality semiconducting NWs. However, the high temperature synthesis process prevents fabrication of NW devices directly over flexible substrates which imply the investigation of efficient transfer techniques such as dry contact printing and electric field assisted assembly. Currently, many efforts are directed to study the integration techniques of NWs from growth substrates to non-conventional receiver substrates and parameters such as transfer-yield, alignment and density. These efforts will help to utilize NWs as building blocks in future flexible electronic devices and circuits. This work focuses on VLS growth of semiconducting NWs and their transfer-printing over large area substrate to fabricate flexible electronics.

Item Type:Conference Proceedings
Glasgow Author(s) Enlighten ID:Dahiya, Professor Ravinder and Garcia Nunez, Dr Carlos and Shakthivel, Dr Dhayalan and Navaraj, Mr William and Liu, Mr Fengyuan
Authors: Shakthivel, D., Liu, F., García Núñez, C., Taube, W., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Published Online:08 August 2017
Copyright Holders:Copyright © 2017 IEEE
First Published:First published in 2017 IEEE 26th International Symposium on Industrial Electronics: 2102-2106
Publisher Policy:Reproduced in accordance with the publisher copyright policy

University Staff: Request a correction | Enlighten Editors: Update this record

Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering and Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG