Development of a Reference Wafer for On-Wafer Testing of Extreme Impedance Devices

Votsi, H., Roch-Jeune, I., Haddadi, K., Li, C. , Dambrine, G., Aaen, P.H. and Ridler, N. (2016) Development of a Reference Wafer for On-Wafer Testing of Extreme Impedance Devices. In: 2016 88th ARFTG Microwave Measurement Conference (ARFTG), Austin, TX, USA, 08-09 Dec 2016, ISBN 9781509045150 (doi: 10.1109/ARFTG.2016.7839719)

Abstract

This paper describes the design, fabrication, and testing of an on-wafer substrate that has been developed specifically for measuring extreme impedance devices using an on-wafer probe station. Such devices include carbon nano-tubes (CNTs) and structures based on graphene which possess impedances in the κ Ω range and are generally realised on the nano-scale rather than the micro-scale that is used for conventional on-wafer measurement. These impedances are far removed from the conventional 50- reference impedance of the test equipment. The on-wafer substrate includes methods for transforming from the micro-scale towards the nano-scale and reference standards to enable calibrations for extreme impedance devices. The paper includes typical results obtained from the designed wafer.

• Item Type: Conference Proceedings
• Additional Information: The work described in this paper was funded and supported by the research project 14IND02 PlanarCal ”Microwave measurements for planar circuits and components” sponsored by the European Metrology Programme for Innovation and Research (EMPIR) and the UK Engineering and Physical Sciences Research Council (EPSRC) grant EP/L02263X/1.
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Li, Professor Chong
• Authors: Votsi, H., Roch-Jeune, I., Haddadi, K., Li, C., Dambrine, G., Aaen, P.H., and Ridler, N.
• College/School: College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• ISBN: 9781509045150
• Copyright Holders: Copyright © 2016 IEEE
• First Published: First published in 2016 88th ARFTG Microwave Measurement Conference (ARFTG)
• Publisher Policy: Reproduced in accordance with the publisher copyright policy