Metal-organic dual layer structure for stretchable interconnects

Dang, W., Vinciguerra, V., Lorenzelli, L. and Dahiya, R. (2016) Metal-organic dual layer structure for stretchable interconnects. Procedia Engineering, 168, pp. 1559-1562. (doi: 10.1016/j.proeng.2016.11.460)

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This paper reports a novel method for obtaining stretchable interconnects using gold and organic material (PEDOT:PSS) in a dual-layer structure on PDMS substrate. With an appropriate design and carefully carried out microfabrication steps, the structure was successfully patterned into serpentine shape and highly stretchable interconnects were obtained. The fabricated interconnects can be stretched up to 170% of their original length while retaining an adequate level of conductivity.

Item Type:Articles
Glasgow Author(s) Enlighten ID:Dahiya, Professor Ravinder and Dang, Ms Wenting
Authors: Dang, W., Vinciguerra, V., Lorenzelli, L., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering
College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Procedia Engineering
Copyright Holders:Copyright © 2016 The Authors
First Published:First published in Procedia Engineering 168: 1559-1562
Publisher Policy:Reproduced under a Creative Commons License

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
682141CONTESTRavinder DahiyaEuropean Commission (EC)317488ENG - ENGINEERING ELECTRONICS & NANO ENG
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG