Terahertz Monolithic Integrated Circuits (TMICs) Array Antenna Technology On GaN-on-Low Resistivity Silicon Substrates

Benakaprasad, B., Eblabla, A., Li, X. , Thayne, I. , Wallis, D., Guiney, I., Humphreys, C. and Elgaid, K. (2016) Terahertz Monolithic Integrated Circuits (TMICs) Array Antenna Technology On GaN-on-Low Resistivity Silicon Substrates. In: 41st International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2016), Copenhagen, Denmark, 25-30 Sept 2016, (doi: 10.1109/IRMMW-THz.2016.7758488)

Abstract

In this paper, we have demonstrated a viable microstrip array patch antenna technology for the first time on GaN-on-low resistivity silicon (LR-Si) substrates (ρ <; 40 Ω.cm) at H-band frequencies (220-325 GHz). The developed technology is compatible with standard MMIC technology with no requirement for high temperature processes. To mitigate the losses presented by the substrate and to enhance the performance of the integrated array antenna at THz frequencies, the driven patch is shielded by silicon nitride and gold layer in addition to a layer of benzocyclobutene (BCB). The demonstrated 4×1 array integrated antenna showed a measured resonance frequency in agreement with our simulation at 0.27 THz; a measured S11 as low as -41 dB was obtained. A directivity, gain and radiation efficiency of 11.2 dB, 5.2 dB, and 20% respectively was observed from the 3D EM model for a 5 μm BCB inset. To the authors' knowledge, this is the first demonstration of a THz integrated microstrip array antenna for TMIC technology; this developed technology is promising for high performance III-V electronic material on low resistivity/high dielectric substrates.

• Item Type: Conference Proceedings
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Li, Dr Xu and Thayne, Prof Iain and Benakaprasad, Miss Bhavana and Elgaid, Dr Khaled
• Authors: Benakaprasad, B., Eblabla, A., Li, X., Thayne, I., Wallis, D., Guiney, I., Humphreys, C., and Elgaid, K.
• College/School: College of Science and Engineering; College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• Published Online: 01 December 2016
• Copyright Holders: Copyright © 2016 IEEE
• Publisher Policy: Reproduced in accordance with the copyright policy of the publisher