Dang, W., Vinciguerra, V., Lorenzelli, L. and Dahiya, R. (2017) Printable stretchable interconnects. Flexible and Printed Electronics, 2(1), 013003. (doi: 10.1088/2058-8585/aa5ab2)
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130421.pdf - Published Version Available under License Creative Commons Attribution. 2MB |
Abstract
This article presents recent progress and a comprehensive overview of stretchable interconnects based on printable nanocomposites. Nanocomposite-based inks for printed stretchable interconnects have been categorized according to dispersed filler materials. They comprise of carbon-based fillers and metal-based fillers. Benefits in terms of excellent electrical performance and elastic properties make nanocomposites the ideal candidates for stretchable interconnect applications. Deeper analysis of nanocomposites-based stretchable interconnects includes the correlation between the size of fillers, percolation ratio, maximum electrical conductivity and mechanical elasticity. The key trends in the field have been highlighted using curve fitting methods on large data collected from the literature. Furthermore, a wide variety of applications for stretchable interconnects are presented.
Item Type: | Articles |
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Status: | Published |
Refereed: | Yes |
Glasgow Author(s) Enlighten ID: | Dahiya, Professor Ravinder and Dang, Ms Wenting |
Authors: | Dang, W., Vinciguerra, V., Lorenzelli, L., and Dahiya, R. |
College/School: | College of Science and Engineering > School of Engineering College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
Journal Name: | Flexible and Printed Electronics |
Publisher: | IOP Publishing |
ISSN: | 2058-8585 |
ISSN (Online): | 2058-8585 |
Published Online: | 13 March 2017 |
Copyright Holders: | Copyright © 2017 IOP Publishing Ltd |
First Published: | First published in Flexible and Printed Electronics 2(1):013003 |
Publisher Policy: | Reproduced under a Creative Commons License |
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