Assembling Micron/Nanoscale Electronic Components using Optoelectronic Tweezers

Zhang, S., Amy, C. and Steven, N. (2015) Assembling Micron/Nanoscale Electronic Components using Optoelectronic Tweezers. Sixth Annual SU2P Symposium, St Andrews UK, 23-24 March 2015.

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Abstract

The aim of this work is to develop a new method with the potential to revolutionise the process of assembling electronic components into circuits. We aim to produce a step change in the size of the smallest components that can be handled from the current smallest standard component size of 400×200 microns (0402 metric) down to components a few microns across and even nanostructured components (based upon graphene, nanowires or nanotubes, for example). This will be accomplished by developing a radically new assembly strategy based on a touch-less manipulation technique known as optoelectronic tweezers (OET). We have demonstrated the use of OET to manipulate conductive silver nanowires into different patterns. A proof-ofconcept demonstration was also made to quantify the feasibility of using OET to manipulate silver nanowires to form a conductive metal path between two electrodes.

Item Type:Conference or Workshop Item
Keywords:optical electronic tweezers; assembling electronic components
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Zhang, Dr Shuailong
Authors: Zhang, S., Amy, C., and Steven, N.
Subjects:Q Science > QC Physics
T Technology > TK Electrical engineering. Electronics Nuclear engineering
College/School:College of Science and Engineering > School of Engineering > Biomedical Engineering
Research Group:Biomedical Engineering (Dr Steven Neale)
Copyright Holders:Copyright © 2015 The Authors
Publisher Policy:Reproduced with the permission of the authors.

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
652331Assembly of electronic components with Optoelectronic TweezersSteven NealeEngineering & Physical Sciences Research Council (EPSRC)EP/L022257/1ENG - BIOMEDICAL ENGINEERING