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Liang, J. et al. (2019) Investigation of Pt-salt-doped-standalone-multiwall carbon nanotubes for on-chip interconnect applications. IEEE Transactions on Electron Devices, 66(5), pp. 2346-2352. (doi: 10.1109/TED.2019.2901658)

Liang, J., Lee, J., Berrada, S., Georgiev, V. , Pandey, R. R., Chen, R., Asenov, A. and Todri-Sanial, A. (2018) Atomistic to circuit-level modeling of doped SWCNT for on-chip interconnects. IEEE Transactions on Nanotechnology, 17(6), pp. 1084-1088. (doi: 10.1109/TNANO.2018.2802320)

Chen, R. et al. (2018) Variability study of MWCNT local interconnects considering defects and contact resistances - Part I: pristine MWCNT. IEEE Transactions on Electron Devices, 65(11), pp. 4955-4962. (doi: 10.1109/TED.2018.2868421)

Chen, R. et al. (2018) Variability study of MWCNT local interconnects considering defects and contact resistances - Part II: impact of charge transfer doping. IEEE Transactions on Electron Devices, 65(11), pp. 4963-4970. (doi: 10.1109/TED.2018.2868424)

Lee, J. et al. (2018) Understanding electromigration in Cu-CNT composite interconnects: a multiscale electrothermal simulation study. IEEE Transactions on Electron Devices, 65(9), pp. 3884-3892. (doi: 10.1109/TED.2018.2853550)

Uhlig, B. et al. (2018) Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects. In: 2018 IEEE International Interconnect Technology Conference (IITC), Santa Clara, CA, USA, 4-7 Jun 2018, pp. 16-18. ISBN 9781538643372 (doi:10.1109/IITC.2018.8430411)

Uhlig, B. et al. (2018) Progress on Carbon Nanotube BEOL Interconnects. In: 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), Dresden, Germany, 19-23 Mar 2018, pp. 937-942. ISBN 9783981926309 (doi:10.23919/DATE.2018.8342144)

Liang, J., Lee, J., Berrada, S., Georgiev, V. , Asenov, A. , Azemard-Crestani, A. and Todri-Sanial, A. (2018) Atomistic to Circuit Level Modeling of Defective Doped SWCNTs with Contacts for On-Chip Interconnect Application. In: 12th IEEE Nanotechnology Materials and Devices Conference (NMDC 2017), Singapore, 2-4 Oct 2017, pp. 66-67. ISBN 9781538627723 (doi:10.1109/NMDC.2017.8350506)

Lee, J. et al. (2017) The Impact of Vacancy Defects on CNT Interconnects: From Statistical Atomistic Study to Circuit Simulations. In: SISPAD 2017: International Conference on Simulation of Semiconductor Processes and Devices, Kamakura, Japan, 7-9 Sept 2017, pp. 157-160. (doi:10.23919/SISPAD.2017.8085288)

Lee, J. et al. (2017) Atoms-to-Circuits Simulation Investigation of CNT Interconnects for Next Generation CMOS Technology. In: SISPAD 2017: International Conference on Simulation of Semiconductor Processes and Devices, Kamakura, Japan, 7-9 Sept 2017, pp. 153-156. (doi:10.23919/SISPAD.2017.8085287)

Todri-Sanial, A. et al. (2017) A survey of carbon nanotube interconnects for energy efficient integrated circuits. IEEE Circuits and Systems Magazine, 17(2), pp. 47-62. (doi: 10.1109/MCAS.2017.2689538)

Liang, J. et al. (2017) A Physics-based Investigation of Pt-salt Doped Carbon Nanotubes for Local Interconnects. In: 2017 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 02-06 Dec 2017, 35.5.1-35.5.4. ISBN 9781538635599 (doi:10.1109/IEDM.2017.8268502)

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