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Ma, S., Kumaresan, Y. , Dahiya, A. S. and Dahiya, R. (2022) Ultra-thin chips with printed interconnects on flexible foils. Advanced Electronic Materials, 8(5), 2101029. (doi: 10.1002/aelm.202101029)

Kumaresan, Y. , Ma, S., Ozioko, O. and Dahiya, R. (2022) Soft capacitive pressure sensor with enhanced sensitivity assisted by ZnO NW interlayers and airgap. IEEE Sensors Journal, 22(5), pp. 3974-3982. (doi: 10.1109/JSEN.2022.3143030)

Ozioko, O. and Dahiya, R. (2022) Smart tactile gloves for haptic interaction, communication and rehabilitation. Advanced Intelligent Systems, 4(2), 2100091. (doi: 10.1002/aisy.202100091)

Kumaresan, Y. , Min, G., Dahiya, A. S., Ejaz, A. , Shakthivel, D. and Dahiya, R. (2022) Kirigami and mogul-patterned ultra-stretchable high-performance ZnO nanowires-based photodetector. Advanced Materials Technologies, 7(1), 2100804. (doi: 10.1002/admt.202100804)

Kumaresan, Y. , Ozioko, O. and Dahiya, R. (2021) Multifunctional electronic skin with a stack of temperature and pressure sensor arrays. IEEE Sensors Journal, 21(23), pp. 26243-26251. (doi: 10.1109/JSEN.2021.3055458)

Ozioko, O., Nassar, H. and Dahiya, R. (2021) 3D printed interdigitated capacitor based tilt sensor. IEEE Sensors Journal, 21(23), pp. 26252-26260. (doi: 10.1109/JSEN.2021.3058949)

Kumaresan, Y. , Ma, S. and Dahiya, R. (2021) PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping. Microelectronic Engineering, 247, 111588. (doi: 10.1016/j.mee.2021.111588)

Ozioko, O., Navaraj, W., Hersh, M. and Dahiya, R. (2020) Tacsac: wearable haptic device with capacitive touch-sensing capability for tactile display. Sensors, 20(17), 4780. (doi: 10.3390/s20174780)

Kumaresan, Y. , Kim, H., Pak, Y., Poola, P. K., Lee, R., Lim, N., Ko, H. C., Jung, G. Y. and Dahiya, R. (2020) Omnidirectional stretchable inorganic-material-based electronics with enhanced performance. Advanced Electronic Materials, 6(7), 2000058. (doi: 10.1002/aelm.202000058)

Dahiya, R. , Yogeswaran, N., Liu, F. , Manjakkal, L. , Burdet, E., Hayward, V. and Jorntell, H. (2019) Large area soft e-skin: the challenges beyond sensor designs. Proceedings of the IEEE, 107(10), pp. 2016-2033. (doi: 10.1109/JPROC.2019.2941366)

This list was generated on Thu May 19 14:14:25 2022 BST.