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Kumaresan, Y. , Ma, S. and Dahiya, R. (2021) PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping. Microelectronic Engineering, 247, 111588. (doi: 10.1016/j.mee.2021.111588)

Ozioko, O. and Dahiya, R. (2021) Smart tactile gloves for haptic interaction, communication and rehabilitation. Advanced Intelligent Systems, (Accepted for Publication)

Ozioko, O., Nassar, H. and Dahiya, R. (2021) 3D printed interdigitated capacitor based tilt sensor. IEEE Sensors Journal, (doi: 10.1109/JSEN.2021.3058949) (Early Online Publication)

Kumaresan, Y. , Ozioko, O. and Dahiya, R. (2021) Multifunctional electronic skin with a stack of temperature and pressure sensor arrays. IEEE Sensors Journal, (doi: 10.1109/JSEN.2021.3055458) (Early Online Publication)

Ozioko, O., Navaraj, W., Hersh, M. and Dahiya, R. (2020) Tacsac: wearable haptic device with capacitive touch-sensing capability for tactile display. Sensors, 20(17), 4780. (doi: 10.3390/s20174780)

Kumaresan, Y. , Kim, H., Pak, Y., Poola, P. K., Lee, R., Lim, N., Ko, H. C., Jung, G. Y. and Dahiya, R. (2020) Omnidirectional stretchable inorganic-material-based electronics with enhanced performance. Advanced Electronic Materials, 6(7), 2000058. (doi: 10.1002/aelm.202000058)

Dahiya, R. , Yogeswaran, N., Liu, F., Manjakkal, L. , Burdet, E., Hayward, V. and Jorntell, H. (2019) Large area soft e-skin: the challenges beyond sensor designs. Proceedings of the IEEE, 107(10), pp. 2016-2033. (doi: 10.1109/JPROC.2019.2941366)

This list was generated on Tue Jul 27 07:39:22 2021 BST.