Micro-coolers fabricated as a component in an integrated circuit

Glover, J., Khalid, A. , Stephen, A., Dunn, G., Cumming, D. and Oxley, C. H. (2015) Micro-coolers fabricated as a component in an integrated circuit. Semiconductor Science and Technology, 30(1), 015005. (doi:10.1088/0268-1242/30/1/015005)

Glover, J., Khalid, A. , Stephen, A., Dunn, G., Cumming, D. and Oxley, C. H. (2015) Micro-coolers fabricated as a component in an integrated circuit. Semiconductor Science and Technology, 30(1), 015005. (doi:10.1088/0268-1242/30/1/015005)

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Publisher's URL: http://dx.doi.org/10.1088/0268-1242/30/1/015005

Abstract

The packing density and power capacity of integrated electronics is increasing resulting in higher thermal flux densities. Improved thermal management techniques are required and one approach is to include thermoelectric coolers as part of the integrated circuit. An analysis will be described showing that the supporting substrate will have a large influence on the cooling capacity of the thermoelectric cooler. In particular, for materials with a low ZT figure of merit (for example gallium arsenide (GaAs) based compounds) the substrate will have to be substantially thinned to obtain cooling, which may preclude the use of thermoelectric coolers, for example, as part of a GaAs based integrated circuit. Further, using experimental techniques to measure only the small positive cooling temperature difference (ΔT) between the anode (Th) and the cathode (Tc) contacts can be misinterpreted as cooling when in fact it is heating.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Cumming, Professor David and Dunn, Dr Geoffrey and Khalid, Dr Ata-ul-Habib
Authors: Glover, J., Khalid, A., Stephen, A., Dunn, G., Cumming, D., and Oxley, C. H.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:Semiconductor Science and Technology
Publisher:IOP Publishing
ISSN:0268-1242
ISSN (Online):1361-6641
Copyright Holders:Copyright © 2015 IOP Publishing Ltd
First Published:First published in Semiconductor Science and Technology 30(1):015005
Publisher Policy:Reproduced under a Creative Commons License

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
497131Novel Thermal Management Concepts: High Power High Frequency Planar Gunn DiodeDavid CummingEngineering & Physical Sciences Research Council (EPSRC)EP/H011862/1ENG - ENGINEERING ELECTRONICS & NANO ENG