Technologies for printing sensors and electronics over large flexible substrates: a review

Khan, S., Lorenzelli, L. and Dahiya, R. (2014) Technologies for printing sensors and electronics over large flexible substrates: a review. IEEE Sensors Journal, 15(6), pp. 3164-3185. (doi:10.1109/JSEN.2014.2375203)

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Publisher's URL: http://dx.doi.org/10.1109/JSEN.2014.2375203

Abstract

Printing sensors and electronics over flexible substrates is an area of significant interest due to low-cost fabrication and possibility of obtaining multifunctional electronics over large areas. Over the years, a number of printing technologies have been developed to pattern a wide range of electronic materials on diverse substrates. As further expansion of printed technologies is expected in future for sensors and electronics, it is opportune to review the common features, complementarities and the challenges associated with various printing technologies. This paper presents a comprehensive review of various printing technologies, commonly used substrates and electronic materials. Various solution/dry printing and contact/non-contact printing technologies have been assessed on the basis of technological, materials and process related developments in the field. Critical challenges in various printing techniques and potential research directions have been highlighted. Possibilities of merging various printing methodologies have been explored to extend the lab developed standalone systems to high-speed roll-to-roll (R2R) production lines for system level integration.

Item Type:Articles
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Dahiya, Professor Ravinder
Authors: Khan, S., Lorenzelli, L., and Dahiya, R.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
Journal Name:IEEE Sensors Journal
Publisher:Institute of Electrical and Electronics Engineers
ISSN:1530-437X
ISSN (Online):1558-1748
Copyright Holders:Copyright © 2014 The Authors
First Published:First published in IEEE Sensors Journal
Publisher Policy:Reproduced under a Creative Commons License

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Project CodeAward NoProject NamePrincipal InvestigatorFunder's NameFunder RefLead Dept
663861Engineering Fellowships for Growth: Printed Tactile SKINRavinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002527/1ENG - ENGINEERING ELECTRONICS & NANO ENG
659051Flexible Electronics Device Modelling (FLEXELDEMO)Ravinder DahiyaEngineering & Physical Sciences Research Council (EPSRC)EP/M002519/1ENG - ENGINEERING ELECTRONICS & NANO ENG