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3D coupled electro-thermal simulations for SOI FinFET with statistical variations including the fin shape dependence of the thermal conductivity

Wang, L., Brown, A.R., Nedjalkov, M., Alexander, C., Cheng, B., Millar, C. and Asenov, A. (2014) 3D coupled electro-thermal simulations for SOI FinFET with statistical variations including the fin shape dependence of the thermal conductivity. In: 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology (ICSICT 2014), Guilin, China, 28-31 Oct 2014,

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Publisher's URL: http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=32164

Abstract

No abstract available.

Item Type:Conference Proceedings
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Alexander, Dr Craig and Millar, Dr Campbell and Wang, Dr Liping and Cheng, Dr Binjie and Asenov, Professor Asen
Authors: Wang, L., Brown, A.R., Nedjalkov, M., Alexander, C., Cheng, B., Millar, C., and Asenov, A.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
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