Wire Bond Free Interconnection for High Frequency Ultrasound Arrays

University Of Dundee / Heriot Watt University (2010) Wire Bond Free Interconnection for High Frequency Ultrasound Arrays. .

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Publisher's URL: http://www.google.com/patents/US20130020907


A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component.

Item Type:Patents
Additional Information:Patent Publication Number: US20130020907 A1
Glasgow Author(s) Enlighten ID:Bernassau, Dr Anne and Desmulliez, Prof Marc
Authors: Bernassau, A., Hutson, D., Cochran, S., and Desmulliez, M.P.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering

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