University Of Dundee / Heriot Watt University (2010) Wire Bond Free Interconnection for High Frequency Ultrasound Arrays. .
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Publisher's URL: http://www.google.com/patents/US20130020907
Abstract
A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component.
| Item Type: | Patents |
|---|---|
| Additional Information: | Patent Publication Number: US20130020907 A1 |
| Status: | Published |
| Glasgow Author(s) Enlighten ID: | Bernassau, Dr Anne and Desmulliez, Prof Marc |
| Authors: | Bernassau, A., Hutson, D., Cochran, S., and Desmulliez, M.P. |
| College/School: | College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering |
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