Characterisation of an Epoxy Filler for Piezocomposite Material Compatible with Microfabrication Processes

Bernassau, A.L., Huston, D., Demore, C.E.M. and Cochran, S. (2008) Characterisation of an Epoxy Filler for Piezocomposite Material Compatible with Microfabrication Processes. In: 2008 IEEE International Ultrasonics Symposium (IUS), Beijing, China, 2-5 Nov 2008, ISBN 9781424424283 (doi:10.1109/ULTSYM.2008.0016)

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Abstract

High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.

Item Type:Conference Proceedings
Status:Published
Refereed:Yes
Glasgow Author(s) Enlighten ID:Cochran, Professor Alexander and Bernassau, Dr Anne and Demore, Dr Christine
Authors: Bernassau, A.L., Huston, D., Demore, C.E.M., and Cochran, S.
College/School:College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
College of Science and Engineering > School of Engineering > Systems Power and Energy
ISSN:1051-0117
ISBN:9781424424283

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