Empirical mixing model for the electromagnetic modelling of on-chip interconnects

Holik, S.M., Arnold, J.M. and Drysdale, T.D. (2011) Empirical mixing model for the electromagnetic modelling of on-chip interconnects. Progress in Electromagnetics Research Letters, 26, pp. 1-9.

Abstract

We present an empirical mixing model for rectangular cuboid metal inclusions in a host dielectric, suitable for replacing the detailed structure of a layer of on-chip interconnects with a homogeneous dielectric slab. Such an approximation is required to facilitate the accurate and efficient package-level electromagnetic modelling of complicated miniaturised systems, such as System-in-Package. Without such an approach, the direct inclusion of large areas of on-chip interconnect structures often results in intractable computation times. Our model allows us to predict the reflection (transmission) coefficient of impinging plane waves to within 3.5% (0.2%) error for incident angles up to 30o off-normal, aspect ratios 0.6-3, metal fill factors 0.3-0.6, and host dielectric constants 1-11.7, over the frequency range 1-10 GHz.

• Item Type: Articles
• Status: Published
• Refereed: Yes
• Glasgow Author(s) Enlighten ID: Drysdale, Dr Timothy and Arnold, Professor John
• Authors: Holik, S.M., Arnold, J.M., and Drysdale, T.D.
• College/School: College of Science and Engineering > School of Engineering > Electronics and Nanoscale Engineering
• Journal Name: Progress in Electromagnetics Research Letters
• ISSN: 1937-6480